System On Module (SOM)
- Consists wireless/wire communication, Power management, Clock, Processors components.
- Multiple system IC on several interposer and a substrate into a single module package.
System in Package (SiP)
- Consists Analog/Memory components.
- Multiple dies on a common substrate into a single package.
2.5D Packaging
- Better heat performance.
- Heterogeneous integration.
- Horizontal integration on the interposer.
3D Packaging
- Best suited for ASICs.
- Use active interposer.
- Vertical and horizontal integration in package.
- Increased functionality density with even smaller size.
- 3D Stacks-group of dies performing the same functions.
- Shorter wiring allows lower power consumption, reduced interconnect delays and capacitance.
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