ENGLISH
繁體中文



   DRAM Type


  • Many of those DRAM chips stacked vertically like floors in Taipei 101 building.
  • New interconnects and many ubumps connect one DRAM chip to the next.
  • Ceramic interposer and ubumps also used to connect the SoC/GPU/CPU,Analog IC and substrate.
  • Suitable for SiP, SOM, customized DRAM modules.